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The adhesion of copper films deposited onto aluminum nitride
The adhesion of copper films deposited onto aluminum nitride
The adhesion of copper films deposited onto aluminum nitride
Park, J.-W. (Autor:in) / Pedraza, A. J. (Autor:in) / Lowndes, D. H. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 34 ; 1933-1942
01.01.1999
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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