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Zhang, Y.X. / Wu, J. / Ji, Y.Y. | British Library Online Contents | 2013

SIMULATION ANALYSIS OF THE VOID LOCATION DURING THE ELECTROMIGRATION BASED ON ATOMIC CONCENTRATION

YANG Jing / JIANG YiMing / CHEN Gang et al. | DOAJ | 2020

Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuits

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Behaviour of Strip Footing Resting on Reinforced Foundation Bed with Underground Void

Jayamohan, J. / Vimal, Aarya / Rajeev, K. P. | TIBKAT | 2016

Challenges of electromigration - Electromigration degradation mechanisms in copper dual-inlaid interconnects -

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