Chemical-Mechanical Polishing of Wafers with Copper Film by Nano-Scale Abrasives

Tsai, J.C. / Kao, J.F. | British Library Online Contents | 2008

Effects of mixed abrasives in chemical mechanical polishing of oxide films

Lu, Z. / Lee, S.-H. / Gorantla, V. R. K. et al. | British Library Online Contents | 2003

Electrochemical Testing of Tantalum and Copper in Chemical Mechanical Polishing Slurries

Liu, Z. / Li, H. / Schmidt, R. et al. | British Library Conference Proceedings | 2006

Characterization of colloidal silica abrasives with different sizes and their chemical-mechanical polishing performance on 4H-SiC (0001)

Shi, X. / Pan, G. / Zhou, Y. et al. | British Library Online Contents | 2014

Polishing Characteristics of CMP for Oxygen Free Copper with Manganese Oxide Abrasives

Sato, R. / Ichida, Y. / Morimoto, Y. et al. | British Library Online Contents | 2009