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Investigation of the role of compositional effects on electromigration damage of metallic interconnects
Investigation of the role of compositional effects on electromigration damage of metallic interconnects
Investigation of the role of compositional effects on electromigration damage of metallic interconnects
Pennetta, C. (Autor:in) / Reggiani, L. (Autor:in) / Trefan, G. (Autor:in) / Fantini, F. (Autor:in) / Scorzoni, A. (Autor:in) / De Munari, I. (Autor:in)
COMPUTATIONAL MATERIALS SCIENCE ; 22 ; 13-18
01.01.2001
6 pages
Aufsatz (Zeitschrift)
Englisch
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