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The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects
The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects
The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects
Hau-Riege, S. P. (Autor:in) / Thompson, C. V. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 15 ; 1797-1802
01.01.2000
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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