Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Induced stresses and structural changes in silicon wafers as a result of laser micro-machining
Induced stresses and structural changes in silicon wafers as a result of laser micro-machining
Induced stresses and structural changes in silicon wafers as a result of laser micro-machining
Amer, M. S. (Autor:in) / Dosser, L. (Autor:in) / LeClair, S. (Autor:in) / Maguire, J. F. (Autor:in)
APPLIED SURFACE SCIENCE ; 187 ; 291-296
01.01.2002
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2005
|Effect of sawing induced micro-crack orientations on fracture properties of silicon wafers
British Library Online Contents | 2016
|Effect of sawing induced micro-crack orientations on fracture properties of silicon wafers
British Library Online Contents | 2016
|Effect of sawing induced micro-crack orientations on fracture properties of silicon wafers
British Library Online Contents | 2016
|Study of stresses in thin silicon wafers with near-infrared phase stepping photoelasticity
British Library Online Contents | 2002
|