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Induced stresses and structural changes in silicon wafers as a result of laser micro-machining
Induced stresses and structural changes in silicon wafers as a result of laser micro-machining
Induced stresses and structural changes in silicon wafers as a result of laser micro-machining
Amer, M. S. (author) / Dosser, L. (author) / LeClair, S. (author) / Maguire, J. F. (author)
APPLIED SURFACE SCIENCE ; 187 ; 291-296
2002-01-01
6 pages
Article (Journal)
English
DDC:
621.35
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