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Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Tungsten Nitride Deposition by Thermal Chemical Vapor Deposition as Barrier Metal for Cu Interconnection
Tungsten Nitride Deposition by Thermal Chemical Vapor Deposition as Barrier Metal for Cu Interconnection
Tungsten Nitride Deposition by Thermal Chemical Vapor Deposition as Barrier Metal for Cu Interconnection
Gonohe, N. (Autor:in)
MATERIALS TRANSACTIONS ; 43 ; 1585-1592
01.01.2002
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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