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    Tungsten Nitride Deposition by Thermal Chemical Vapor Deposition as Barrier Metal for Cu Interconnection

    New search for: Gonohe, N.

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    Tungsten Nitride Deposition by Thermal Chemical Vapor Deposition as Barrier Metal for Cu Interconnection

    New search for: Gonohe, N.

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    Access via TIB
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    Tungsten Nitride Deposition by Thermal Chemical Vapor Deposition as Barrier Metal for Cu Interconnection

    New search for: Gonohe, N.

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Title:

    Tungsten Nitride Deposition by Thermal Chemical Vapor Deposition as Barrier Metal for Cu Interconnection

    Contributors:

    Gonohe, N. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 43 ; 1585-1592

    Publication date:

    2002-01-01

    Size:

    8 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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