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Application of High-pressure Annealing Process to Dual Damascene Copper Interconnections
Application of High-pressure Annealing Process to Dual Damascene Copper Interconnections
Application of High-pressure Annealing Process to Dual Damascene Copper Interconnections
Onishi, T. (Autor:in) / Yoshikawa, T. (Autor:in)
MATERIALS TRANSACTIONS ; 43 ; 1605-1614
01.01.2002
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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