Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Formation of Slit-Like Voids at Trench Corners of Damascene Cu Interconnects
Formation of Slit-Like Voids at Trench Corners of Damascene Cu Interconnects
Formation of Slit-Like Voids at Trench Corners of Damascene Cu Interconnects
Sekiguchi, A. (Autor:in) / Koike, J. (Autor:in) / Maruyama, K. (Autor:in)
MATERIALS TRANSACTIONS ; 43 ; 1633-1637
01.01.2002
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Effect of Trench Aspect Ratio on Microstructure and Texture in Damascene Cu Interconnects
British Library Online Contents | 2012
|Texture Investigations In Damascene Copper Interconnects
British Library Online Contents | 2002
|Self-Annealing Textures of Copper Damascene Interconnects
British Library Online Contents | 2004
|Texture Investigation in Cu Damascene Interconnects during Annealing
British Library Online Contents | 2005
|Molecular dynamics study of copper trench filling in damascene process
British Library Online Contents | 2005
|