Texture of Electroplated Copper Film under Biaxial Stress

Hong, B. / Jiang, C.-h. / Wang, X.-j. | British Library Online Contents | 2006

Texture of Electroplated Coatings of Copper and Bismuth Telluride

Chaouni, H. / Magri, P. / Bessieres, J. et al. | British Library Online Contents | 1994

Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film

Kim, S.-H. / Kang, J.-H. / Han, S.Z. | British Library Online Contents | 2010

Evolution of Grain and Micro-Void Structure in Electroplated Copper Interconnects

Hobbs, A. / Murakami, S. / Hosoda, T. et al. | British Library Online Contents | 2002

Influence of ECAP Modes on Texture and Microstructure Evolution of Aluminium and Copper

Kusnierz, J. | British Library Online Contents | 2003