Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film: Fid-Bau Portal

Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film

Chonan, Y. / Komiyama, T. / Onuki, J. / Urao, R. / Kimura, T. / Nagano, T.

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Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film

Chonan, Y. / Komiyama, T. / Onuki, J. / Urao, R. / Kimura, T. / Nagano, T.

Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film

Chonan, Y. / Komiyama, T. / Onuki, J. / Urao, R. / Kimura, T. / Nagano, T.

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Titel:

Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film

Beteiligte:

Chonan, Y. (Autor:in) / Komiyama, T. (Autor:in) / Onuki, J. (Autor:in) / Urao, R. (Autor:in) / Kimura, T. (Autor:in) / Nagano, T. (Autor:in)

Erschienen in:

MATERIALS TRANSACTIONS ; 43 ; 1840-1846

Erscheinungsdatum:

01.01.2002

Format / Umfang:

7 pages

ISSN:

1345-9678

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Chonan, Y. / Komiyama, T. / Onuki, J. et al. | British Library Online Contents | 2002

Influence of Zincate Treatment on Adhesion Strength of Electroless Nickel-Phosphorus Plated Film for Commercial Pure Aluminum

Murakami, K. / Hino, M. / Hiramatsu, M. et al. | British Library Online Contents | 2006

Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system

Kang, H.-B. / Lee, J.-W. / Bae, J.-H. et al. | British Library Online Contents | 2008

A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM

Choi, J. K. / Kang, H. B. / Lee, J. W. et al. | British Library Online Contents | 2004

Plated structures : stability and strength

Narayanan, R. | TIBKAT | 1983

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