Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film: Fid-Bau Portal

Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film

Chonan, Y. / Komiyama, T. / Onuki, J. / Urao, R. / Kimura, T. / Nagano, T.

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Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film

Chonan, Y. / Komiyama, T. / Onuki, J. / Urao, R. / Kimura, T. / Nagano, T.

Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film

Chonan, Y. / Komiyama, T. / Onuki, J. / Urao, R. / Kimura, T. / Nagano, T.

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Title:

Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film

Contributors:

Chonan, Y. (author) / Komiyama, T. (author) / Onuki, J. (author) / Urao, R. (author) / Kimura, T. (author) / Nagano, T. (author)

Published in:

MATERIALS TRANSACTIONS ; 43 ; 1840-1846

Publication date:

2002-01-01

Size:

7 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Chonan, Y. / Komiyama, T. / Onuki, J. et al. | British Library Online Contents | 2002

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