A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM: Fid-Bau Portal

A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM

Choi, J. K. / Kang, H. B. / Lee, J. W. / Jung, S. B. / Yang, C. W.

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A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM

Choi, J. K. / Kang, H. B. / Lee, J. W. / Jung, S. B. / Yang, C. W.

A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM

Choi, J. K. / Kang, H. B. / Lee, J. W. / Jung, S. B. / Yang, C. W.

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Titel:

A Study on Interfacial Reaction between Electroless Plated Ni-P/Au UBM and Sn-Bi Eutectic Solder Using AEM

Beteiligte:

Choi, J. K. (Autor:in) / Kang, H. B. (Autor:in) / Lee, J. W. (Autor:in) / Jung, S. B. (Autor:in) / Yang, C. W. (Autor:in) / Kang, S.-G. / Kobayashi, T.

Erschienen in:

Designing, Processing and Properties of Advanced Engineering Materials PART 1 ; 405-408

MATERIALS SCIENCE FORUM ; 449/452

Erscheinungsdatum:

01.01.2004

Format / Umfang:

4 pages

ISSN:

0255-5476

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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