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Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder
Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder
Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder
Lee, C.-B. (Autor:in) / Jung, S.-B. (Autor:in) / Shin, Y.-E. (Autor:in) / Shur, C.-C. (Autor:in)
MATERIALS TRANSACTIONS ; 43 ; 1858-1863
01.01.2002
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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