Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and Electroless Ni-P/Cu Substrate by Solid-State Isothermal Aging

Yoon, J. W. / Lee, C. B. / Jung, S. B. | British Library Online Contents | 2004

Effect of Isothermal Aging on Ball Shear Strength in BGA Joints with Sn-3.5Ag-0.75Cu Solder

Lee, C.-B. / Jung, S.-B. / Shin, Y.-E. et al. | British Library Online Contents | 2002

Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging

Kim, S. T. / Huh, J. Y. | British Library Online Contents | 2005

Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy

Jang, D.M. / Yu, J. | British Library Online Contents | 2011

Evolution of Intermetallic Compound at the Interface between AuSn Solder and Metallization Layer

Wei, Z. / Chunqing, W. / Bohan, Y. | British Library Online Contents | 2006