Deformation behaviour during low cycle fatique testing of 60Sn-40Pb solder

Sandstroem, R. / Oesterberg, J.-O. / Nylen, M. | British Library Online Contents | 1993

Reduced Electrical Resistivity of Ternary Solder Alloy of Tin-Copper-Sulfur: An Anti-Oxidative Role of Sulfur in Binary Solder Alloy of Tin-Copper

Kim, S.H. / Kim, Y.-J. / Lim, T.-S. et al. | British Library Online Contents | 2014

Effect of Mn on Sn-Ag-Cu ternary lead free solder alloy-Cu assembly: a comparative study

Ghosh, M. / Gunjan, M.K. / Das, S.K. et al. | British Library Online Contents | 2010

Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints

Zhang, K.K. / Wang, Y.L. / Fan, Y.L. et al. | British Library Online Contents | 2010

The Role of Pb Impurity in SAC Solder Alloy

Gergely, G. / Molnar, A. / Gacsi, Z. | British Library Online Contents | 2013