Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Reduced Electrical Resistivity of Ternary Solder Alloy of Tin-Copper-Sulfur: An Anti-Oxidative Role of Sulfur in Binary Solder Alloy of Tin-Copper
Reduced Electrical Resistivity of Ternary Solder Alloy of Tin-Copper-Sulfur: An Anti-Oxidative Role of Sulfur in Binary Solder Alloy of Tin-Copper
Reduced Electrical Resistivity of Ternary Solder Alloy of Tin-Copper-Sulfur: An Anti-Oxidative Role of Sulfur in Binary Solder Alloy of Tin-Copper
Kim, S.H. (Autor:in) / Kim, Y.-J. (Autor:in) / Lim, T.-S. (Autor:in) / Yang, D.-Y. (Autor:in) / Yang, S. (Autor:in)
MATERIALS TRANSACTIONS ; 55 ; 1513-1516
01.01.2014
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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