Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps: Fid-Bau Portal

Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps

Huang, C.-S. / Duh, J.-G.

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Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps

Huang, C.-S. / Duh, J.-G.

Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps

Huang, C.-S. / Duh, J.-G.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

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Titel:

Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps

Beteiligte:

Huang, C.-S. (Autor:in) / Duh, J.-G. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 18 ; 935-940

Erscheinungsdatum:

01.01.2003

Format / Umfang:

6 pages

ISSN:

0884-2914

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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Interfacial stability of eutectic SnPb solder and composite 60Pb40Sn solder on Cu/Ni(V)/Ti under-bump metallization

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Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration

Liu, Y.-H. / Lin, K.-L. | British Library Online Contents | 2005

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