Microstructure evolution during electromigration in eutectic SnPb solder bumps

Lu, C. M. / Shao, T. L. / Yang, C. J. et al. | British Library Online Contents | 2004

Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

Jang, J.-W. / De Silva, A. P. / Lin, J.-K. et al. | British Library Online Contents | 2004

Microstructural evolution during electromigration in eutectic SnAg solder bumps

Chen, Y. H. / Shao, T. L. / Liu, P. C. et al. | British Library Online Contents | 2005

Electromigration at the high-Pb-eutectic SnPb solder interface

Lai, C. L. / Lin, C. H. / Chen, C. | British Library Online Contents | 2004

Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps

Huang, C.-S. / Duh, J.-G. | British Library Online Contents | 2003