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Interfacial stability of eutectic SnPb solder and composite 60Pb40Sn solder on Cu/Ni(V)/Ti under-bump metallization
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 735-741
01.01.2007
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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