Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization: Fid-Bau Portal

Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization

Chen, H.-Y. / Chen, C.

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Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization

Chen, H.-Y. / Chen, C.

Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization

Chen, H.-Y. / Chen, C.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Measurement of electromigration activation energy in eutectic SnPb and SnAg flip-chip solder joints with Cu and Ni under-bump metallization

Beteiligte:

Chen, H.-Y. (Autor:in) / Chen, C. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 25 ; 1847-1853

Erscheinungsdatum:

01.01.2010

Format / Umfang:

7 pages

ISSN:

0884-2914

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Huang, C.-S. / Duh, J.-G. | British Library Online Contents | 2003

Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Lee, A. / Ho, C. E. / Subramanian, K. N. | British Library Online Contents | 2007

Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mum-thick Cu under-bump metallization

Nah, J.-W. / Chen, K. / Tu, K. N. et al. | British Library Online Contents | 2007

Interfacial stability of eutectic SnPb solder and composite 60Pb40Sn solder on Cu/Ni(V)/Ti under-bump metallization

Wu, A. T. / Hua, F. | British Library Online Contents | 2007

Microstructure evolution during electromigration in eutectic SnPb solder bumps

Lu, C. M. / Shao, T. L. / Yang, C. J. et al. | British Library Online Contents | 2004

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