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Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions
Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions
Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions
Guo, F. (Autor:in) / Choi, S. (Autor:in) / Subramanian, K. N. (Autor:in) / Bieler, T. R. (Autor:in) / Lucas, J. P. (Autor:in) / Achari, A. (Autor:in) / Paruchuri, M. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 351 ; 190-199
01.01.2003
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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