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Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions
Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions
Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions
Guo, F. (author) / Choi, S. (author) / Subramanian, K. N. (author) / Bieler, T. R. (author) / Lucas, J. P. (author) / Achari, A. (author) / Paruchuri, M. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 351 ; 190-199
2003-01-01
10 pages
Article (Journal)
English
DDC:
620.11
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