Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu
Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu
Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu
El-Daly, A. A. (Autor:in) / Mohamad, A. Z. (Autor:in) / Fawzy, A. (Autor:in) / El-Taher, A. M. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 528 ; 1055-1062
01.01.2011
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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