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Relaxation of thermal stress by dislocation motion in passivated metal interconnects
Relaxation of thermal stress by dislocation motion in passivated metal interconnects
Relaxation of thermal stress by dislocation motion in passivated metal interconnects
Nicola, L. (Autor:in) / Van der Giessen, E. (Autor:in) / Needleman, A. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 1216-1226
01.01.2004
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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