Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects: Fid-Bau Portal

Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects

Choi, Z.-S. / Monig, R. / Thompson, C.V.

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Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects

Choi, Z.-S. / Monig, R. / Thompson, C.V.

Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects

Choi, Z.-S. / Monig, R. / Thompson, C.V.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Ähnliche Titel

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Titel:

Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects

Beteiligte:

Choi, Z.-S. (Autor:in) / Monig, R. (Autor:in) / Thompson, C.V. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 383-391

Erscheinungsdatum:

01.01.2008

Format / Umfang:

9 pages

ISSN:

0884-2914

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Zschech, E. / Meyer, M. A. / Grafe, M. et al. | British Library Online Contents | 2004

Damage mechanics of electromigration in microelectronics copper interconnects

Basaran, Cemal / Lin, Minghui | British Library Online Contents | 2007

Electromigration in ULSI interconnects

Tan, C. M. / Roy, A. | British Library Online Contents | 2007

Electromigration and IC Interconnects

Thompson, C. V. / Lloyd, J. R. | British Library Online Contents | 1993

Hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects

Ang, D. / Ramanujan, R. V. | British Library Online Contents | 2006

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