Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Structural investigations of gold-to-gold wafer bonding interfaces
Structural investigations of gold-to-gold wafer bonding interfaces
Structural investigations of gold-to-gold wafer bonding interfaces
Kim, H. W. (Autor:in) / Kim, N. H. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 110 ; 64-67
01.01.2004
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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