A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Structural investigations of gold-to-gold wafer bonding interfaces
Structural investigations of gold-to-gold wafer bonding interfaces
Structural investigations of gold-to-gold wafer bonding interfaces
Kim, H. W. (author) / Kim, N. H. (author)
MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 110 ; 64-67
2004-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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