Thermal Characteristics and Intermetallic Compounds Formed at Sn-9Zn-0.5Ag/Cu Interface

Chang, T.-C. / Hon, M.-H. / Wang, M.-C. | British Library Online Contents | 2004

Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface

Tsukamoto, H. / Dong, Z.G. / Huang, H. et al. | British Library Online Contents | 2010

Effect of Isothermal Aging on the Growth and Morphology of the Intermetallic Compounds Formed at the Solder/Cu Interface of the Lead - Free Solder Joint

Fu, Y. / Zhang, Q. / Sun, F. et al. | British Library Online Contents | 2007

Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging

Xia, Y. / Xie, X. / Lu, C. | British Library Online Contents | 2006

Effect of Thermal Treatment on the Intermetallic Compounds Formed at Sn-9Zn-1.5Ag-xBi (x = 0 and 1) Lead-Free Solder/Cu Interface

Liu, C.-Y. / Chen, Y.-R. / Li, W.-L. et al. | British Library Online Contents | 2007