Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder
Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder
Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder
Nishikawa, H. (Autor:in) / Takemoto, T. (Autor:in) / Kifune, K. (Autor:in) / Uetani, T. (Autor:in) / Sekimori, N. (Autor:in)
MATERIALS TRANSACTIONS ; 45 ; 741-746
01.01.2004
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2005
|Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint
British Library Online Contents | 2005
|Lead-free Solder Wafer Bumping
British Library Online Contents | 2004
|A novel bumping process for fine pitch Sn-Cu lead-free plating-based flip chip solder bumps
British Library Online Contents | 2007
|Material developed for lead-free solder
British Library Online Contents | 2004