Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder: Fid-Bau Portal

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder

Nishikawa, H. / Takemoto, T. / Kifune, K. / Uetani, T. / Sekimori, N.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder

Nishikawa, H. / Takemoto, T. / Kifune, K. / Uetani, T. / Sekimori, N.

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder

Nishikawa, H. / Takemoto, T. / Kifune, K. / Uetani, T. / Sekimori, N.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder

Contributors:

Nishikawa, H. (author) / Takemoto, T. (author) / Kifune, K. (author) / Uetani, T. (author) / Sekimori, N. (author)

Published in:

MATERIALS TRANSACTIONS ; 45 ; 741-746

Publication date:

2004-01-01

Size:

6 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Nakamura, K. / Shohji, I. / Goto, H. et al. | British Library Online Contents | 2005

Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint

Shohji, I. / Goto, H. / Nakamura, K. et al. | British Library Online Contents | 2005

Lead-free Solder Wafer Bumping

Dimock, F. / Mattson, K. | British Library Online Contents | 2004

Material developed for lead-free solder

British Library Online Contents | 2004

Thermomigration in lead-free solder joints

Abdulhamid, M.F. / Li, S. / Basaran, C. | British Library Online Contents | 2008