Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints
Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints
Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints
Lin, Y. H. (Autor:in) / Tsai, C. M. (Autor:in) / Hu, Y. C. (Autor:in) / Lin, Y. L. (Autor:in) / Tsai, J. Y. (Autor:in) / Kao, C. R. (Autor:in)
MATERIALS SCIENCE FORUM ; 475/479 ; 2655-2658
01.01.2005
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Electromigration failure in flip chip solder joints due to rapid dissolution of copper
| British Library Online Contents | 2003
Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints
| British Library Online Contents | 2004
Three-dimensional model for electromigration induced evolution of flip chip solder joints
| British Library Online Contents | 2009
| British Library Online Contents | 2008
| British Library Online Contents | 2008