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Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints

Lin, Y. H. / Tsai, C. M. / Hu, Y. C. / Lin, Y. L. / Tsai, J. Y. / Kao, C. R.

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Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints

Lin, Y. H. / Tsai, C. M. / Hu, Y. C. / Lin, Y. L. / Tsai, J. Y. / Kao, C. R.

Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints

Lin, Y. H. / Tsai, C. M. / Hu, Y. C. / Lin, Y. L. / Tsai, J. Y. / Kao, C. R.

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Document information

Title:

Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints

Contributors:

Lin, Y. H. (author) / Tsai, C. M. (author) / Hu, Y. C. (author) / Lin, Y. L. (author) / Tsai, J. Y. (author) / Kao, C. R. (author)

Published in:

MATERIALS SCIENCE FORUM ; 475/479 ; 2655-2658

Publication date:

2005-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Hu, Y. C. / Lin, Y. H. / Kao, C. R. et al. | British Library Online Contents | 2003

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Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

Yang, D. | British Library Online Contents | 2008

Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

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