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Strained-Si n-MOS surface-channel and buried Si0.7Ge0.3 compressively-strained p-MOS fabricated in a 0.25mm heterostructure CMOS process
Strained-Si n-MOS surface-channel and buried Si0.7Ge0.3 compressively-strained p-MOS fabricated in a 0.25mm heterostructure CMOS process
Strained-Si n-MOS surface-channel and buried Si0.7Ge0.3 compressively-strained p-MOS fabricated in a 0.25mm heterostructure CMOS process
Paul, D. J. (Autor:in) / Temple, M. (Autor:in) / Olsen, S. H. (Autor:in) / ONeill, A. G. (Autor:in) / Tang, Y. T. (Autor:in) / Waite, A. M. (Autor:in) / Cerrina, C. (Autor:in) / Evans, A. G. (Autor:in) / Li, X. (Autor:in) / Zhang, J. (Autor:in)
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING ; 8 ; 343-346
01.01.2005
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.38152
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