Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Numerical Study of Creep Damage Behavior of Thin Film/Substrate Systems under Indentation
Numerical Study of Creep Damage Behavior of Thin Film/Substrate Systems under Indentation
Numerical Study of Creep Damage Behavior of Thin Film/Substrate Systems under Indentation
Xu, B. X. (Autor:in) / Wan, J. S. (Autor:in) / Zhao, B. (Autor:in) / Yue, Z. F. (Autor:in)
MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK ; 36 ; 75-80
01.01.2005
6 pages
Aufsatz (Zeitschrift)
Deutsch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2007
|Simulation of the creep damage behavior of thin film/substrate systems by bending creep tests
British Library Online Contents | 2010
|British Library Online Contents | 2001
|Determination of Elastic and Creep Properties of Thin-film Systems from Indentation Experiments
British Library Online Contents | 2000
|Evaluation of the substrate effect on indentation behavior of film/substrate system
British Library Online Contents | 2010
|