Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Simulation of the creep damage behavior of thin film/substrate systems by bending creep tests
Simulation of the creep damage behavior of thin film/substrate systems by bending creep tests
Simulation of the creep damage behavior of thin film/substrate systems by bending creep tests
Wen, S. F. (Autor:in) / Yan, W. Z. (Autor:in) / Kang, J. X. (Autor:in) / Liu, J. (Autor:in) / Yue, Z. F. (Autor:in)
MATERIALS AND DESIGN -REIGATE- ; 31 ; 3531-3536
01.01.2010
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.0042
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