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Numerical Study of Creep Damage Behavior of Thin Film/Substrate Systems under Indentation
Numerical Study of Creep Damage Behavior of Thin Film/Substrate Systems under Indentation
Numerical Study of Creep Damage Behavior of Thin Film/Substrate Systems under Indentation
Xu, B. X. (author) / Wan, J. S. (author) / Zhao, B. (author) / Yue, Z. F. (author)
MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK ; 36 ; 75-80
2005-01-01
6 pages
Article (Journal)
German
DDC:
620.11
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