Very long-term aging of 52In–48Sn (at.%) solder joints on Cu-plated stainless steel substrates

Susan, D. F. / Rejent, J. A. / Hlava, P. F. et al. | British Library Online Contents | 2009

Contact Resistance of the Chip-on-Glass Bonded 48Sn-52In Solder Joint

Choi, J.-H. / Lee, K.-Y. / Jun, S.-W. et al. | British Library Online Contents | 2005

Analysis of the Test Parameters in the Shear Test of BGA Solder Joints

Kim, J. W. / Park, S. K. / Jung, S. B. | British Library Online Contents | 2005

Standardization of a shear test method for lead-free solder paste chip joints

Choi, J. K. / Park, J. H. / Ahn, Y. S. | British Library Online Contents | 2007

Interfacial reactions and mechanical properties of In-48Sn solder joint with electroplated Au-Ni ball grid array (BGA) substrate after multiple reflows

Koo, J.-M. / Yoon, J.-W. / Jung, S.-B. | British Library Online Contents | 2008