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Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers
Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers
Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers
Stangl, M. (Autor:in) / Dittel, V. (Autor:in) / Acker, J. (Autor:in) / Hoffmann, V. (Autor:in) / Gruner, W. (Autor:in) / Strehle, S. (Autor:in) / Wetzig, K. (Autor:in)
APPLIED SURFACE SCIENCE ; 252 ; 158-161
01.01.2005
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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