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    Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers

    New search for: Stangl, M.
    New search for: Dittel, V.
    New search for: Acker, J.
    New search for: Hoffmann, V.
    New search for: Gruner, W.
    New search for: Strehle, S.
    New search for: Wetzig, K.

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    Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers

    New search for: Stangl, M.
    New search for: Dittel, V.
    New search for: Acker, J.
    New search for: Hoffmann, V.
    New search for: Gruner, W.
    New search for: Strehle, S.
    New search for: Wetzig, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers

    New search for: Stangl, M.
    New search for: Dittel, V.
    New search for: Acker, J.
    New search for: Hoffmann, V.
    New search for: Gruner, W.
    New search for: Strehle, S.
    New search for: Wetzig, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers

    Contributors:

    Stangl, M. (author) / Dittel, V. (author) / Acker, J. (author) / Hoffmann, V. (author) / Gruner, W. (author) / Strehle, S. (author) / Wetzig, K. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 252 ; 158-161

    Publication date:

    2005-01-01

    Size:

    4 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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