Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders

Shohji, I. / Yoshida, T. / Takahashi, T. et al. | British Library Online Contents | 2002

Modification effect of Sr on the microstructures and mechanical properties of Al-10.5Si-2.0Cu recycled alloy for die casting

Shin, S. S. / Kim, E. S. / Yeom, G. Y. et al. | British Library Online Contents | 2012

Wetting of microcrystalline and nanocrystalline Ni substrates by molten Sn-3.5Ag-0.7Cu alloy

Yang, J. / Shen, P. / Yin, Z. et al. | British Library Online Contents | 2010

Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly

Mostafa Shalaby, Rizk / Kamal, Mustafa / Ali, Esmail A.M. et al. | British Library Online Contents | 2017

Impression creep characterization of rapidly cooled Sn-3.5Ag solders

Dutta, I. / Park, C. / Choi, S. | British Library Online Contents | 2004