Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The Experimental Study on Lapping and Polishing of Metal Micro-Coil Based on Silicon Wafer
The Experimental Study on Lapping and Polishing of Metal Micro-Coil Based on Silicon Wafer
The Experimental Study on Lapping and Polishing of Metal Micro-Coil Based on Silicon Wafer
Liu, B. D. (Autor:in) / Guan, J. L. (Autor:in) / Li, D. S. (Autor:in) / Li, H. Q. (Autor:in)
KEY ENGINEERING MATERIALS ; 304/305 ; 422-425
01.01.2006
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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