A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Role of film intrinsic stress in packaging of multi-layer microelectronic structures
Role of film intrinsic stress in packaging of multi-layer microelectronic structures
Role of film intrinsic stress in packaging of multi-layer microelectronic structures
Sarihan, V. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 421 ; 109-117
2006-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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