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Texture of Electroplated Copper Film under Biaxial Stress

Hong, B. / Jiang, C.-h. / Wang, X.-j.

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Texture of Electroplated Copper Film under Biaxial Stress

Hong, B. / Jiang, C.-h. / Wang, X.-j.

Texture of Electroplated Copper Film under Biaxial Stress

Hong, B. / Jiang, C.-h. / Wang, X.-j.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Texture of Electroplated Copper Film under Biaxial Stress

Contributors:

Hong, B. (author) / Jiang, C.-h. (author) / Wang, X.-j. (author)

Published in:

MATERIALS TRANSACTIONS ; 47 ; 2299-2301

Publication date:

2006-01-01

Size:

3 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Chaouni, H. / Magri, P. / Bessieres, J. et al. | British Library Online Contents | 1994

Texture evolution of electroplated copper under various modes of convection. Effect of dissolved oxygen

Fricoteaux, P. / Douglade, J. | British Library Online Contents | 2002

Grain growth, stress, and impurities in electroplated copper

Brongersma, S. H. / Kerr, E. / Vervoort, I. et al. | British Library Online Contents | 2002

Effect of passivation on stress relaxation in electroplated copper films

Gan, D. / Ho, P. S. / Pang, Y. et al. | British Library Online Contents | 2006

Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film

Kim, S.-H. / Kang, J.-H. / Han, S.Z. | British Library Online Contents | 2010