Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 ^oC: Fid-Bau Portal

Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 ^oC

Yoon, J.-W. / Lim, J. H. / Lee, H.-J. / Joo, J. / Jung, S.-B. / Moon, W.-C.

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Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 ^oC

Yoon, J.-W. / Lim, J. H. / Lee, H.-J. / Joo, J. / Jung, S.-B. / Moon, W.-C.

Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 ^oC

Yoon, J.-W. / Lim, J. H. / Lee, H.-J. / Joo, J. / Jung, S.-B. / Moon, W.-C.

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Zugriff über TIB

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Titel:

Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 ^oC

Beteiligte:

Yoon, J.-W. (Autor:in) / Lim, J. H. (Autor:in) / Lee, H.-J. (Autor:in) / Joo, J. (Autor:in) / Jung, S.-B. (Autor:in) / Moon, W.-C. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 21 ; 3196-3204

Erscheinungsdatum:

01.01.2006

Format / Umfang:

9 pages

ISSN:

0884-2914

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders

Shohji, I. / Yoshida, T. / Takahashi, T. et al. | British Library Online Contents | 2002

Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system

Kang, H.-B. / Lee, J.-W. / Bae, J.-H. et al. | British Library Online Contents | 2008

Impression creep characterization of rapidly cooled Sn-3.5Ag solders

Dutta, I. / Park, C. / Choi, S. | British Library Online Contents | 2004

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