Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 ^oC: Fid-Bau Portal

Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 ^oC

Yoon, J.-W. / Lim, J. H. / Lee, H.-J. / Joo, J. / Jung, S.-B. / Moon, W.-C.

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Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 ^oC

Yoon, J.-W. / Lim, J. H. / Lee, H.-J. / Joo, J. / Jung, S.-B. / Moon, W.-C.

Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 ^oC

Yoon, J.-W. / Lim, J. H. / Lee, H.-J. / Joo, J. / Jung, S.-B. / Moon, W.-C.

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Title:

Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 ^oC

Contributors:

Yoon, J.-W. (author) / Lim, J. H. (author) / Lee, H.-J. (author) / Joo, J. (author) / Jung, S.-B. (author) / Moon, W.-C. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 21 ; 3196-3204

Publication date:

2006-01-01

Size:

9 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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