Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Role of titanium on the reactive spreading of lead-free solders on alumina
Role of titanium on the reactive spreading of lead-free solders on alumina
Role of titanium on the reactive spreading of lead-free solders on alumina
Gremillard, L. (Autor:in) / Saiz, E. (Autor:in) / Radmilovic, V. R. (Autor:in) / Tomsia, A. P. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 21 ; 3222-3233
01.01.2006
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Spreading Dynamics of Tin, Bismuth and Some Lead-Free Solders over Copper Substrate
British Library Online Contents | 2005
|British Library Online Contents | 2000
|Lead-free Solders in Microelectronics
British Library Online Contents | 2000
|The Recrystallization of Microelectronic Lead-Free Solders
British Library Online Contents | 2008
|Nanoindentation of lead-free solders in microelectronic packaging
British Library Online Contents | 2007
|