Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films
The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films
The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films
Miyamura, T. (Autor:in) / Koike, J. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 445-446 ; 620-624
01.01.2007
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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